With the 7nm and 5nm manufacturing process progressing successfully, TSMC started to increase the number of production lines for 3nm production.
We can easily say that the Taiwanese semiconductor manufacturer TSMC has done quite well in the recent period. The company’s 7nm order volume is quite large, and it was reported that even the 5nm production capacity was recently filled. At this point, the most important factor is undoubtedly Apple.
According to the current report of DigiTimes TSMC, 3nm technology went to expand production lines in order to prepare for high volume production. The 3nm process is expected to enter high-volume production in 2022, which 2022 is not far from.
The new production lines will initially produce 55,000 wafers (disc plates) with a size of 300 mm and this figure is expected to reach 100,000 in 2023. TSMC has also expedited the purchase of EUV machines and with this they have all the necessary equipment for production.
Technology giant, as well as 3nm Also plans for 2nm fabrication brings it to life quickly. The company will use a different production technique in this process and when we look at the possible production date, we see 2024.
Expected TSMC Scaling
|Development||7nm to 5nm||N5 to N5P||N5 to N4 (5nm)||From 5nm to 3nm|
|Power Increase at Same Performance||30%||10%||?||25-30%|
|Same Power Performance Increase||15%||5%||?||10-15%|